This system is being used for the deposition of single or multiplayer metal electrode on semiconductor devices. This is a load-lock system allowing faster throughput and better vacuum quality. The system has a multi-hearth e-gun with 6-pocket crucibles and10 KW power supply, auto pump control, substrate heaters, an ion-gun and multi-layer deposition controller. The thickness of deposited layer is monitored using quartz crystal sensor and the vacuum is maintained below 10-6 ~ 10-7 Torr by turbo molecular pump. :